(From www.powerelectronicsnews.com, Author: Maurizio Di Paolo Emilio)
2024 has been a crucial year for the power electronics sector in terms of development, preparing for radical changes in 2025 and beyond. Wide-bandgap (WBG) semiconductors and artificial-intelligence (AI) integration are primarily driving this change.
WBG technologies such as gallium nitride and silicon carbide are gaining popularity, as they provide exceptional efficiency and performance in uses such as solar energy systems and electric-vehicle inverters. The next frontier is investigating ultra-WBG materials such as diamond and gallium oxide (Ga2O3). In both materials, I anticipate additional advancements in 2025. Although simpler scalability makes Ga2O3 devices more popular, diamond technologies might still have manufacturing difficulties and costs. Both materials will enhance SiC and GaN, thereby promoting next-generation power conversion and electrification technologies.
AI is set to revolutionize power electronics through what Fraunhofer calls “cognitive power electronics.” Already in use today, intelligent power modules are predicted to develop into systems capable of predictive maintenance and real-time health monitoring. These developments could enable devices to predict failures, thus enhancing system dependability and lowering downtime. An inverter may, for instance, notify operators of a possible transistor breakdown days in advance, thus offering practical information to avoid interruptions. Furthermore, hastening the commercial acceptance of these ultra-WBG technologies is this combination of AI with power electronics.
From developments in semiconductor materials to the junction of AI and power systems, the coming years will see notable jumps in power electronics. Working hand in hand, industry and academics will help to shape a future with smarter, more efficient, sustainable energy solutions.
Automotive
Adoption of 48-V systems is expected to rise in 2025, having important effects on sectors including data centers and automotive. These systems will be rather important in applications such as thermal management and advanced driver-assistance systems, thus improving overall EV performance. Furthermore, integrating 48-V motors and pumps into EVs will help lower the dependency on copper in motor windings, thus producing lighter, more efficient cars. Along with increasing range, this reduces manufacturing costs.
Along with this change in the EV industry toward higher-voltage systems—such as 800-V designs and beyond—will come the use of SiC power semiconductors. In fields such as traction inverters, on-board chargers, and fast-charging infrastructure, these components will be very vital. Supported by their exceptional thermal performance and higher switching rates, WBG technologies will improve EV performance and efficiency, thus supporting the growing need for energy storage options.
Concurrent developments in electric motor technology will be vital for the direction of sustainable mobility. Combining cutting-edge control systems with materials and manufacturing technologies will improve dynamic reaction and dependability, thereby defining new benchmarks for e-mobility in the coming years.
Wide bandgap
The power industry is facing significant challenges in reducing environmental impact and meeting growing energy needs, particularly in the e-mobility and infrastructure sectors. WBG semiconductors such as SiC and GaN are emerging as the primary decarbonization options. These materials may greatly lower energy losses in traction systems and charging infrastructure with their great efficiency and higher temperature operation capability.
However, there are challenges in adopting these technologies, particularly concerning reliability and burn-in testing. The need for new stress and test methodologies for WBG devices is crucial to ensure compliance with quality standards.
Lowering prices and enhancing power device performance depend on advanced technologies such as 300-mm GaN wafers, which also help to enable further acceleration in the switch to the electrification of transportation. With the deployment (not yet at ideal levels) of possible low-cost EVs aimed at the mass market, electrification has become a top concern in the automotive industry. The acceptance of WBG technology will decrease the cost and increase the efficiency of these cars.
In 2024, Infineon Technologies AG made significant strides in the development of its 300 mm power gallium nitride (GaN) technology, solidifying its position as a leader in the growing GaN market. According to Infineon, going forward, the 300 mm GaN will further strengthen the company’s leadership in power systems by mastering all relevant power technologies, be it silicon, silicon carbide or gallium nitride.
Optimizing electric grid management also depends critically on incorporating AI and machine-learning technologies into the charging infrastructure. Through better charging techniques and guaranteed wiser energy distribution, AI will assist in managing the grid load. This combined with standardizing the charging infrastructure will make the electrification of transportation not only feasible but also viable.
While technologies such as nuclear power might still be very important in guaranteeing grid stability and fulfilling climate targets, the global energy balance in 2025 will show more drive toward renewables.
The WBG sector’s primary technological objectives for 2025 consist of:
- Lower prices and bigger wafers: The main aim for 2025 will be 300-mm GaN wafer size. While raising production capacity, the manufacturing of bigger wafers will drastically cut prices. Particularly for automotive and energy uses, this development will enable more accessible and reasonably priced GaN power devices.
- Lower switching losses and more efficiency: SiC in particular is recognized for lowering switching losses—up to 90% in high-power electric motors. SiC devices will be significantly more refined in 2025 to help lower energy losses and raise traction system and charging infrastructure efficiency.
- Improved robustness and reliability: WBG devices must be able to run in automotive and high-temperature industrial settings. Future advancements will concentrate on enhancing the durability and stability of electronics, even under thermal and electrical stress, thereby strengthening their resilience.
- Integration of WBG devices with new topologies for power supplies: WBG devices will be combined into sophisticated topologies, including those for energy storage systems and quick charging of EVs. WBG solutions will progressively fit high-power needs, accelerating the charging speed and dependability of infrastructure.
- Evolving materials to improve performance and reduce costs: The evolution of materials will help further improve the efficiency of systems and lower manufacturing costs, making these technologies affordable on a large scale. In particular, the evolution of substrates for GaN will enable them to improve their performance at high voltages, becoming a thorn in the side for SiC.
A few years ago, 6-inch SiC chips were costly, but advancements have improved quality and reduced manufacturing challenges. Wolfspeed achieved 200-mm SiC wafer production through vertical integration, enabling better control over epitaxial layer quality for high-voltage devices up to 10 kV.
GaN-on-Si uses both 6-inch and 200-mm wafers, though maintaining MOCVD uniformity at larger sizes can be challenging. GaN-on-Si offers a balance of cost and efficiency, while SiC is preferred for higher voltage, thermal insulation, and performance. Recent progress with 12-inch GaN-on-Si demonstrates the potential for both low- and high-voltage applications.
According to Infineon, GaN based power semiconductors find fast adoption in industrial, automotive, and consumer, computing & communication applications, including power supplies for AI systems, solar inverters, chargers and adapters, and motor-control systems. State of the art GaN manufacturing processes will further lead to improved device performance resulting in benefits in end customers’ applications as it enables efficiency performance, smaller size, lighter weight, and lower overall cost. A fully scaled 300 mm GaN production will also contribute to GaN cost parity with silicon on RDS(on) level, which means cost parity for comparable Si and GaN products. “Infineon will continue to drive innovation and growth in the GaN market, with a focus on expanding customer base and increasing market share. With a strong performance in 2024 and a solid foundation for growth, Infineon is well-positioned to capitalize on the opportunities in the GaN market in 2025 and beyond,” said a spokesperson for Infineon.
Cem Basceri, Qromis CEO, highlighted that VIS will continue offering 200mm Gen1 GaN-on-QST 650V E-mode devices for consumer electronics and launch Gen2 devices for industrial and automotive applications. Additionally, VIS will be developing 200mm 1,200V E-mode devices for product launch later in 2026. In parallel, IMEC will provide 1,200V GaN-on-QST processes, vertical power devices, and wafer-level monolithic ICs to its core partners and offer licenses to industry players.
“A QROMIS-IMEC-ShinEtsu collaboration will develop 300mm GaN-on-QST technology, while ShinEtsu and QROMIS will introduce Gen2 QST substrates with a SiC growth interface, boosting GaN epitaxy performance to next levels. Additionally, QROMIS, ShinEtsu, and VIS plan to ramp production of 200mm QST substrates, epi wafers, and devices. QROMIS also aims to expand its robust IP portfolio, currently nearing 300 worldwide patents, driving advancements in high-performance GaN power devices,” said Basceri.
Key growth drivers
Comprising about 70% of the total addressable market, EV traction inverters are the most prominent category in the SiC industry. With the automobile industry and other e-mobility uses including ships and airplanes leading the way, this trend is projected to continue. Currently, many EV producers worldwide are already using SiC in their vehicles.
Another main area of development for SiC is the quick spread of fast-charging infrastructure. Fast-charging trends are driving power needs into hundreds of kilowatts. For instance, Tesla has said that its first 500-kW EV chargers—which can charge commercial vehicles at 1.2 MW—will go on sale in 2025. Other areas of development are renewable energy and industrial automation. About 400 GW of solar capacity is being built worldwide, most of which is moving to SiC for inverter and battery storage energy conversion.
GaN is growing quickly thanks to data centers. In fact, GaN is projected to be the fastest-growing technology over the next few years. As data centers and future consumer electronics like computers switch to 48-V power distribution, low-voltage GaN devices are perfect for these uses. More powerful GaN devices, such as those in the 650-V class, work well with a wide range of users’ power needs, such as those of freezers, washing machines, and other 30-W to 200-W devices. GaN with a lot of power can also be used in cars for things like on-board chargers and DC/DC converters. GaN can also be used in EV power converters, which makes them more efficient at low loads. It is believed that the lateral GaN device will rule this space because it has built-in benefits, such as the 2DEG and higher mobility that vertical devices don’t have. GaN is also very cost-effective because it is mostly made on silicon plates, which lets companies use existing silicon plants and keep capital costs low. Low-voltage GaN devices don’t need thick epitaxial layers (<1 µm), which makes them cheaper than other options.
According to Alex Lidow, CEO of EPC, GaN technology has already made significant inroads into AI server cards, specifically in their DC/DC converters. “The next step is the AI rack AC/DC system,” he said. “GaN is ideal for addressing the challenges of the tight 1U form factor as power levels increase from 3 kW to 5 kW and beyond to 8 kW. Multi-level GaN solutions are the optimal approach to meet these demands.”
In addition to AI infrastructure, GaN ICs and FETs are playing a pivotal role in humanoid robots. “Their smaller size, lighter weight, and higher efficiency make them essential for powering motors in components such as arms, legs, knees, ankles, hips, fingers, and elbows,” Lidow said. “GaN also finds application in LiDAR sensors—serving as the ‘eyes’ of humanoids—and in DC/DC converters, which function as their ‘heart.’ As performance improves and costs decline, humanoid robots are expected to gain broader adoption over the next decade, further solidifying GaN’s position in this emerging market.”
Motor control applications and requirements
The power range for automobile motor power goes from tens of watts for small cars that are used in cities to megawatts for business and industrial trucks. When switching rates are low, as in traction inverters, conduction losses are the most important thing to consider, especially when the load is light. The market for industrial motor drives, which is worth about $5 billion, is dominated by silicon IGBTs. About 40% of all the electricity used in the world goes to motors, which run everything from lifts to conveyor belts. The International Energy Agency has made energy standards stricter, which encourages the use of SiC in these areas. Even a small, 2% increase in efficiency can quickly pay for itself in capital spending. SiC also has benefits in terms of being smaller and lighter, and it may be possible to use higher switching frequencies, which lower noise and make motor positioning more accurate.
GaN’s high switching speeds (hundreds of kilohertz) are very helpful for low-voltage motors used in robots and drones. When it comes to frequency, these motors don’t have the same problems as motors that are powered by the mains, such as shielding and gear failures. Because the passives are smaller, low-voltage drives that work at these high frequencies can get better power levels. Concerns about GaN reliability mostly come from flaws in the manufacturing process and breakdowns caused by thermal and mechanical stress. However, once these problems are under control, GaN devices are very dependable, lasting longer and having lower failure rates than silicon power devices. GaN can also control motors with high power and low frequency.
Silicon IGBTs and even SiC MOSFETs often need parallel Schottky diodes to improve reverse conduction, but GaN devices are much better at this. GaN has a smaller gate charge, which makes parasitic turn-on less likely. Another benefit is that many GaN makers combine sense, protection, and drive features into one unit. This makes the system more reliable by keeping devices in a safe working area.
Problems with the package, such as bond wire liftoff or die stress cracks, are common ways for motor controls to stop working properly. New methods of packaging, such as hardening for the top or bottom side, are making things more reliable, especially in vehicle uses wherein temperature changes of up to 80°C can happen.
Llew Vaughan-Edmunds, Senior Director of Product Management & Marketing for GaN and SiC at Navitas, stated that “Motor Drives will start to transition to SiC and GaN, as gap between SiC and WBG continues to reduce. Robotics will emerge and become a hot topic. MV (Medium Voltage) and LV (Low Voltage) GaN will play an important part for high speed motors and improved efficiency for longer battery life.”
Thermal management trends
Particularly in sectors such as EVs and green energy, the next several years will see many developments and fresh trends in thermal management in power electronics:
- Better cooling materials: Thermally conductive polymers, carbon-based alloys, and better ceramic materials—among other materials that eliminate heat—will show significant gains here.
- More effective liquid-cooling solutions: Liquid cooling will find use in more systems, particularly those requiring a lot of energy. Innovations will aim to simplify liquid-cooling systems and increase the efficiency of heat exchangers through lighter and simpler construction. This will allow improved power levels in next-generation semiconductor goods to be feasible.
- Integrated thermal management: Building thermal management solutions straight into components such as PCBs and chip packs will become increasingly frequent over the next few years. Reducing the requirement for several cooling systems would help designs to be smaller and more efficient.
- Thermal optimization driven by AI: Real-time thermal management and tracking will probably find increasing utility as AI keeps improving. Real-time data from temperature sensors will enable AI-powered systems to determine the optimal approach to chill objects down, therefore altering performance and efficiency on demand. For managing the complex temperature trends in high-performance applications, this is crucial.
- Adding energy to aerospace and heavy industry: These sectors will need innovative cooling solutions to manage the additional power demand when they add electricity. For instance, fresh approaches to heat management will be required in electric aircraft and space exploration to cope with high power levels while maintaining safety and reliability.
- Hybrid-cooling solutions: People more commonly combine active and passive cooling techniques nowadays. More means of lowering heat in power systems will be available, and they will be more effective. Combining heat pipes with liquid-cooling or electrical materials is a more imaginative approach to eliminate heat.
- Sustainability: Future thermal management systems will concentrate on cooling technology that utilizes less energy as environmental issues gain more importance. The top focus will be given, for instance, to cooling systems using renewable energy sources or materials superior in heat conductivity without compromising the environment.
Data centers
Maximizing efficiency and sustainability will be the main priorities of the next phase of data centers looking ahead to 2025 to satisfy the growing power consumption of AI and high-performance computers. Data centers must change their power distribution systems to move to higher voltages, such as 48 V, 50 V, and even 800 V, as CPUs pushing over 2,000 W and even 4,000 W for GPU-based servers change their power output. Cooling will also witness innovation: Immersion cooling and liquid-to-liquid solutions will play a major role in lowering power usage effectiveness. With an eye on recyclable materials, energy-efficient power sources, and improved cooling technologies drawn from the EV sector, sustainable design will take the front stage.
Llew Vaughan-Edmunds, Senior Director of Product Management & Marketing for GaN and SiC at Navitas, predicts that as AI demand grows, datacenter PSUs will transition to GaN and SiC, moving into mass production. Additionally, LV(Low Voltage)/MV (Medium Voltage) GaN will become essential for POL systems in CPU/GPUs.
Infrastructure and energy
The power grid will become more bidirectional in 2025, facilitating not just significant power generation but also the integration of remote resources. These sites comprise residences, businesses, and other infrastructure actively supporting energy generation and consumption. The grid will not only adapt to peak demand but also provide smarter solutions to maximize the usage of renewable energy as wind, solar and green hydrogen thanks to the great acceptance of energy storage technologies.
Fast-charging stations based on WBG semiconductors, including SiC, which will cut charging times by 50%, will cause rapid development in charging infrastructure for EVs. These charging stations will become a vital component in developing smart cities and e-mobility plans, thus enabling the global acceptance of EVs.
Expanding the green hydrogen infrastructure will be another step toward a sustainable energy grid driven by renewable sources and connected with electrolysis systems creating hydrogen from renewable energy in 2025.
Llew Vaughan-Edmunds, Senior Director of Product Management & Marketing for GaN and SiC, Navitas, anticipates that EV demand will increase in the second half of 2025, leading to the first use of GaN in production for OBCs by Q4 2025. He also expects EV infrastructure to regrow, with SiCPAK modules being an ideal solution for fast charging. Additionally, the solar market is projected to grow in the second half of 2025, with bi-directional technology being perfect for next-generation micro-inverters, offering higher power density and efficiency.
According to Infineon, the structural trends decarbonization and digitalization will define the market long-term. Decarbonization is a strong driver for renewable energies and the expansion of the energy infrastructure. This will further accelerate the expansion of renewable energies and investments in energy efficiency.
“Decarbonization requires a systemic change in how we generate, transport and consume energy. According to calculations by the International Energy Agency, the share of global power generation accounted for by renewables will need to increase from around 12 percent to over 70 percent by 2050 to keep the 1.5°C climate target within reach. Although demand for semiconductors for solar systems has recently been lower because customers and installers have built up substantial inventories, the installation rate remains high. We therefore anticipate that business involving our differentiating power modules for solar inverters will pick up again once inventory levels have returned to normal,” said a spokesperson for Infineon.
What’s next for 2025: hydrogen-powered transportation
Given that the transportation sector continues to be a major contributor to global greenhouse gas emissions, the move to sustainable fuels is essential. Hydrogen looks to be a suitable cure, especially for heavy-duty vehicles such as trucks. Leading the push with its hydrogen-powered trucks using standard internal combustion engines, Volvo Trucks is planning to conduct road testing in 2026. Driven by pure “green” hydrogen, these vehicles provide the benefit of greatly reducing emissions without the long recharge times connected with electric trucks. While running with low CO2 emissions, Volvo’s creative application of High-Pressure Direct Injection technology guarantees more economical fuel consumption and higher engine output.
Still, a big challenge for hydrogen cars to be accepted broadly by 2025 is infrastructure development. Traveling long distances will call for a robust infrastructure of hydrogen filling stations. Driven by economies of scale and technological improvements, the cost of generating green hydrogen from renewable sources and developing hydrogen-powered automobiles must become more affordable. Notwithstanding these challenges, hydrogen offers great potential not just for heavy-duty vehicles but also for more general purposes such as ships and airplanes, thus enabling the creation of a more sustainable transportation system.
Why industries are adopting DC power: the technical implementation and prospects
DC grids are progressing toward a bright future by improving their performance and making it easier to integrate them into industry systems. There has been a lot of work to make DC systems smart. These grids will be smart enough to control the energy flow, include local green energy sources, and make the best use of energy.
Smart grids will keep factories running even when the power goes out because they balance supply and demand in real-time. They will also cut down on high loads, which will save energy and money overall.
DC grids will likely be very important in making companies more sustainable, resilient, and flexible as technology changes. Putting these systems together will help production meet the world’s growing energy needs and make the future cleaner and healthier.
Nuclear
The changing needs of sectors such as data centers, which are quickly requiring more energy to run AI, cloud computing, and other resource-intensive applications, will define nuclear energy’s future in even greater detail. Innovative ideas such as small modular reactors (SMRs) and nuclear microreactors are being investigated as a sustainable means to fulfill this increasing need given that global data center energy usage is expected to triple by 2030. With capacities ranging from 300 MWe, SMRs provide modular and scalable power solutions that enable localized energy generation with fewer safety issues because of their passive safety systems. Long-term operations find these reactors more efficient as they need less regular refueling.
Nuclear microreactors provide small, stable power in a size small enough for places that are far away or not connected to the grid. These reactors can keep working for up to 10 years without the need to be refueled. This ensures that important processes such as AI-driven data centers always have access to power.
There are some problems with (fission) nuclear energy, but it has a lot of potential as a long-term power source for places that use a lot of energy, such as data centers. One of the biggest problems is the high cost of building nuclear plants, such as SMRs and microreactors. The initial cost and long approval and building times are still problems with modular designs, even though they claim to save money.
The way people see things is another problem. Even though safety has improved, nuclear power is still viewed skeptically because of past accidents and the chance of radiation leaks. To build faith in this technology, people will need to learn about it and communicate clearly. Taking care of waste is another big problem. Today’s reactors make less waste, and new ideas such as deep geological reserves are being looked into as possible solutions. However, the toxic waste from nuclear energy needs to be handled carefully and kept safely for decades or even centuries.
Addressing the issue of nuclear waste will be crucial in determining the role of nuclear power in the decades to come. Innovations in waste reduction, such as next-generation reactors with improved efficiency, and secure disposal methods, like deep geological repositories, offer hope for a cleaner and safer future.
